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Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors

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Abstract

Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mm×3.3mm×2.4mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

© 2009 OSA, IEEE Photonics Society, SPIE, COS, CIC

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