Hybrid Silicon / III-V Devices for Optical Interconnects

John E. Bowers; Martijn J. R. Heck; Yongbo Tang; Siddharth Jain

doi:10.1364/IPRSN.2012.ITu4B.1

Advanced Photonics Congress
OSA Technical Digest (online) (Optica Publishing Group, 2012),
paper ITu4B.1
•https://doi.org/10.1364/IPRSN.2012.ITu4B.1

Hybrid Silicon / III-V Devices for Optical Interconnects

John E. Bowers, Martijn J. R. Heck, Yongbo Tang, and Siddharth Jain

Integrated Photonics Research, Silicon and Nanophotonics 2012

Colorado Springs, Colorado United States
17–20 June 2012
ISBN: 978-1-55752-946-6

From the session
Integration of Silicon Photonics with Other Technologies (ITu4B)

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J. E. Bowers, M. J. R. Heck, Y. Tang, and S. Jain, "Hybrid Silicon / III-V Devices for Optical Interconnects," in Advanced Photonics Congress, OSA Technical Digest (online) (Optica Publishing Group, 2012), paper ITu4B.1.

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Abstract

A hybrid silicon integrated broadband (60-nm) DFB array and high-speed modulator (50 Gbps) are presented, showing the potential of this technology for future transmitters in optical interconnects.

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