High-density and Low-cost 10-Gbps x 12ch Optical Modules for High-end Optical Interconnect Applications

Takaaki Ishikawa; Atsushi Suzuki; Yoshitsugu Wakazono; Daisuke Nagao; Tomoyuki Hino; Yoichi Hashimoto; Hiroshi Masuda; Shuji Suzuki; Mitsuaki Tamura; Tei-ichi Suzuki; Katsuya Kikuchi; Yoshikuni Okada; Hiroshi Nakagawa; Masahiro Aoyagi; Takashi Mikawa

Optical Fiber Communication Conference/National Fiber Optic Engineers Conference
OSA Technical Digest (CD) (Optica Publishing Group, 2008),
paper OMK6

High-density and Low-cost 10-Gbps x 12ch Optical Modules for High-end Optical Interconnect Applications

Takaaki Ishikawa, Atsushi Suzuki, Yoshitsugu Wakazono, Daisuke Nagao, Tomoyuki Hino, Yoichi Hashimoto, Hiroshi Masuda, Shuji Suzuki, Mitsuaki Tamura, Tei-ichi Suzuki, Katsuya Kikuchi, Yoshikuni Okada, Hiroshi Nakagawa, Masahiro Aoyagi, and Takashi Mikawa

Optical Fiber Communication Conference 2008

San Diego, California United States
24–28 February 2008
ISBN: 978-1-55752-859-9

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Photodetectors (OMK)

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T. Ishikawa, A. Suzuki, Y. Wakazono, D. Nagao, T. Hino, Y. Hashimoto, H. Masuda, S. Suzuki, M. Tamura, T. Suzuki, K. Kikuchi, Y. Okada, H. Nakagawa, M. Aoyagi, and T. Mikawa, "High-density and Low-cost 10-Gbps x 12ch Optical Modules for High-end Optical Interconnect Applications," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference, OSA Technical Digest (CD) (Optica Publishing Group, 2008), paper OMK6.

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Abstract

We demonstrated 10-Gbps/ch operation of high-density and low-cost 12-channel optical modules. High-Δ bent fiber connector is butt-coupled with OE-substrate. Fabricated module is as small as 10mm × 10mm footprint with thickness of 6mm.

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