Optoelectronic Package having Optical Waveguide Hole and 4-ch × 10-Gb/s Chip-to-Chip Interconnection using Thin-film Waveguide Connector

Yutaka Takagi; Atsushi Suzuki; Toshikazu Horio; Takeshi Ohno; Toshifumi Kojima; Toshikatsu Takada; Satoshi Iio; Kazushige Obayashi; Masahiko Okuyama

doi:10.1364/OFC.2009.OTuL5

Optical Fiber Communication Conference and National Fiber Optic Engineers Conference
OSA Technical Digest (CD) (Optica Publishing Group, 2009),
paper OTuL5
•https://doi.org/10.1364/OFC.2009.OTuL5

Optoelectronic Package having Optical Waveguide Hole and 4-ch × 10-Gb/s Chip-to-Chip Interconnection using Thin-film Waveguide Connector

Yutaka Takagi, Atsushi Suzuki, Toshikazu Horio, Takeshi Ohno, Toshifumi Kojima, Toshikatsu Takada, Satoshi Iio, Kazushige Obayashi, and Masahiko Okuyama

Optical Fiber Communication Conference 2009

San Diego, California United States
22–26 March 2009
ISBN: 978-1-55752-865-0

From the session
Low Bend Loss Fiber and Optical Interconnects (OTuL)

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Y. Takagi, A. Suzuki, T. Horio, T. Ohno, T. Kojima, T. Takada, S. Iio, K. Obayashi, and M. Okuyama, "Optoelectronic Package having Optical Waveguide Hole and 4-ch × 10-Gb/s Chip-to-Chip Interconnection using Thin-film Waveguide Connector," in Optical Fiber Communication Conference and National Fiber Optic Engineers Conference, OSA Technical Digest (CD) (Optica Publishing Group, 2009), paper OTuL5.

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Abstract

We have developed optoelectronic packages having optical waveguide holes with core-clad structure for chip-to-chip interconnection within computer systems. 4-channels × 10 Gb/s signal transmissions between packages were demonstrated with thin-film polymer waveguide.

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