Chip-to-chip optical interconnects

J. A. Kash; F. E. Doany; L. Schares; C. L. Schow; C. Schuster; D. M. Kuchta; P. K. Pepeljugoski; J. M. Trewhella; C. W. Baks; R. A. John; L. Shan; Y. H. Kwark; R. A. Budd; P. Chiniwalla; F. R. Libsch; J. Rosner; C. K. Tsang; C. S. Patel; J. D. Schaub; D. Kucharski; D. Guckenberger; S. Hegde; H. Nyikal; R. Dangel; F. Horst; B. J. Offrein; C. K. Lin; A. Tandon; G. R. Trott; M. Nystrom; D. Bour; M. R. T. Tan; D. W. Dolfi

Optical Fiber Communication Conference and Exposition and The National Fiber Optic Engineers Conference
Technical Digest (CD) (Optica Publishing Group, 2006),
paper OFA3

Chip-to-chip optical interconnects

J. A. Kash, F. E. Doany, L. Schares, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, R. Dangel, F. Horst, B. J. Offrein, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, et al.

Optical Fiber Communication Conference 2006

Anaheim, California United States
5–10 March 2006
ISBN: 1-55752-802-0

From the session
Optical Interconnect Technology (OFA)

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
J. A. Kash, F. E. Doany, L. Schares, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, R. Dangel, F. Horst, B. J. Offrein, C. K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. Bour, M. R. T. Tan, and D. W. Dolfi, "Chip-to-chip optical interconnects," in Optical Fiber Communication Conference and Exposition and The National Fiber Optic Engineers Conference, Technical Digest (CD) (Optica Publishing Group, 2006), paper OFA3.

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Save article

Abstract

Terabus is based on a silicon-carrier interposer on an organic card containing 48 polymer waveguides. We have demonstrated 4×12 arrays of low power optical transmitters and receivers, operating up to 20 Gb/s and 14 Gb/s per channel respectively.

PDF Article

More Like This

Terabus: A Waveguide-Based Parallel Optical Interconnect

F. Doany, J. Kash, D. Kuchta, P. Pepeljugoski, L. Schares, J. Scliaub, C. Schow, J. Trewhella, C. Baks, Y. Kwark, C. Schuster, L. Shan, C. Patel, C. Tsang, J. Rosner, F. Libsch, R. Budd, P. Chiniwalla, R. Dangel, B. Offrein, D. Guckenberger, D. Kucharski, M. Tan, G. Trott, D. Lin, A. Tandon, and M. Nystrom
FTuI4 Frontiers in Optics (FiO) 2005

Chip-to-chip board-level optical data buses

F. E. Doany, C. L. Schow, R. Budd, C. Baks, D. M. Kuchta, P. Pepeljugoski, J. A. Kash, F. Libsch, R. Dangel, F. Horst, and B.J. Offrein
OThS4 Optical Fiber Communication Conference (OFC) 2008

24-Channel Optical Transceiver Module for Waveguide-on-card Interconnects

Jeffrey A. Kash, Clint L. Schow, Fuad E. Doany, Benjamin G. Lee, Cornelia K. Tsang, Christian Baks, Young Kwark, and John U. Knickerbocker
OTuH3 Optical Fiber Communication Conference (OFC) 2010

Previous Article Next Article