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Conference Paper
Asia Communications and Photonics Conference and Exhibition
Shanghai China
November 2-6, 2009
ISBN: 978-1-55752-877-3
Photodetectors (FH)

Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors

Hongtao Han and Keith Main

http://dx.doi.org/10.1364/ACP.2009.FH6


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Abstract

Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mmx3.3mmx2.4mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

© OSA, IEEE Photonics Society, SPIE, COS, CIC

OCIS Codes
(130.0130) Integrated optics : Integrated optics
(130.3120) Integrated optics : Integrated optics devices
(220.0220) Optical design and fabrication : Optical design and fabrication
(220.4610) Optical design and fabrication : Optical fabrication

Citation
H. Han and K. Main, "Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors," in Asia Communications and Photonics Conference and Exhibition, Technical Digest (CD) (Optical Society of America, 2009), paper FH6.
http://www.opticsinfobase.org/abstract.cfm?URI=ACP-2009-FH6


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