Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.
© 2005 Optical Society of America
S. Kumpatla, J. Casswell, and J. Snowdon, " Solutions to Optoelectronic Interconnect Problems," in Adaptive Optics: Analysis and Methods/Computational Optical Sensing and Imaging/Information Photonics/Signal Recovery and Synthesis Topical Meetings on CD-ROM, Technical Digest (Optical Society of America, 2005), paper JWB2.
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