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  • Conference on Lasers and Electro-Optics/International Quantum Electronics Conference and Photonic Applications Systems Technologies
  • Technical Digest (CD) (Optica Publishing Group, 2004),
  • paper CMY2

Confining collateral damage to less than 10nm during femtosecond laser machining

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Abstract

We have ablated holes in pre-thinned Si foils using an ultrafast laser. High resolution imaging of the edges of these holes reveal collateral damage limited to within 10 nanometers.

© 2004 Optical Society of America

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