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Conference Paper
Conference on Lasers and Electro-Optics
San Francisco, California United States
May 16, 2004
ISBN: 1-55752-770-9
Material Modification with Femtosecond Pulses (CMY)

Confining collateral damage to less than 10 nm during femtosecond laser machining

Yoosuf N. Picard, Steven M. Yalisove, Hsiao-hua Liu, and Gerard Mourou

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Abstract

We have ablated holes in pre-thinned Si foils using an ultrafast laser. High resolution imaging of the edges of these holes reveal collateral damage limited to within 10 nanometers.

© 2004 Optical Society of America

OCIS Codes
(240.0240) Optics at surfaces : Optics at surfaces
(240.0310) Optics at surfaces : Thin films
(350.0350) Other areas of optics : Other areas of optics
(350.1820) Other areas of optics : Damage

Citation
Y. N. Picard, S. M. Yalisove, H. Liu, and G. Mourou, "Confining collateral damage to less than 10 nm during femtosecond laser machining," in Conference on Lasers and Electro-Optics/International Quantum Electronics Conference and Photonic Applications Systems Technologies, Technical Digest (CD) (Optical Society of America, 2004), paper CMY2.
http://www.opticsinfobase.org/abstract.cfm?URI=CLEO-2004-CMY2


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