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Optica Publishing Group
  • Conference on Lasers and Electro-Optics/International Quantum Electronics Conference and Photonic Applications Systems Technologies
  • Technical Digest (CD) (Optica Publishing Group, 2004),
  • paper CThT1

Single Fiber Bi-Directional Links using 3D Stacked Thin Film Emitters and Detectors Integrated onto CMOS Transceiver Circuits

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Abstract

The demand for higher bandwidth has created a need for fiber optics in a wide variety of applications [1]. For bi-directional communications, many of these fiber optic communication systems use two optical fibers. To simplify the network and reduce costs, it is possible to provide bi-directional communications over a single fiber [2], which is widely implemented in Japan. Methods of realizing bi-directional communication on a single fiber include using a single optoelectronic device for emission and detection (compromises the performance of the device for either function), or using a splitter (increases the system cost). In this paper, we demonstrate the stacking of a GaAs-based thin film emitter directly on top of a InGaAs-based thin film photodetector which is integrated directly onto a Si CMOS transceiver circuit. This is the first demonstration of a mixed material 3D thin film device stack, and the first demonstration of such a 3D device stack integrated onto a Si CMOS integrated circuit.

© 2004 Optical Society of America

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