A novel post-processing fabrication technique, based on XeF<sup>2</sup>etching, has been developed to locally remove the silicon substrate beneath polysilicon waveguides, enabling integration of low-loss strong-confinement microphotonics into standard bulk-silicon CMOS process flows.
© 2008 Optical Society of America
(220.0220) Optical design and fabrication : Optical design and fabrication
(220.4000) Optical design and fabrication : Microstructure fabrication
(230.0230) Optical devices : Optical devices
(230.7370) Optical devices : Waveguides
C. W. Holzwarth, J. S. Orcutt, H. Li, M. A. Popovic, V. Stojanovic, J. L. Hoyt, R. J. Ram, and H. I. Smith, "Localized Substrate Removal Technique Enabling Strong-Confinement Microphotonics in Bulk Si CMOS Processes," in Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest (CD) (Optical Society of America, 2008), paper CThKK5.
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