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Conference Paper
Conference on Lasers and Electro-Optics
San Jose, California United States
May 4-9, 2008
ISBN: 978-1-55752-859-9
Semiconductor Optoelectronics (CThKK)

Localized Substrate Removal Technique Enabling Strong-Confinement Microphotonics in Bulk Si CMOS Processes

Charles W. Holzwarth, Jason S. Orcutt, Hanqing Li, Milos A. Popovic, Vladimir Stojanovic, Judy L. Hoyt, Rajeev J. Ram, and Henry I. Smith

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Abstract

A novel post-processing fabrication technique, based on XeF<sup>2</sup>etching, has been developed to locally remove the silicon substrate beneath polysilicon waveguides, enabling integration of low-loss strong-confinement microphotonics into standard bulk-silicon CMOS process flows.

© 2008 Optical Society of America

OCIS Codes
(220.0220) Optical design and fabrication : Optical design and fabrication
(220.4000) Optical design and fabrication : Microstructure fabrication
(230.0230) Optical devices : Optical devices
(230.7370) Optical devices : Waveguides

Citation
C. W. Holzwarth, J. S. Orcutt, H. Li, M. A. Popovic, V. Stojanovic, J. L. Hoyt, R. J. Ram, and H. I. Smith, "Localized Substrate Removal Technique Enabling Strong-Confinement Microphotonics in Bulk Si CMOS Processes," in Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies, OSA Technical Digest (CD) (Optical Society of America, 2008), paper CThKK5.
http://www.opticsinfobase.org/abstract.cfm?URI=CLEO-2008-CThKK5


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