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Conference Paper
Conference on Lasers and Electro-Optics
Baltimore, Maryland United States
May 31, 2009 - June 5, 2009
ISBN: 978-1-55752-869-8
Novel 2-D and 3-D Microscopy (CTuAA)

Nanometer Metrology Using Ultrafast Optoacoustics

Thomas J. Grimsley, Fan Yan, Cuong H. Dang, Shan Che, Andrew Antonelli, Humphrey J. Maris, Qiang Zhang, and Arto V. Nurmikko


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We present a method for accessing nanoscale dimensions in semiconductor wafer metrology, using ultrafast optoacoustic ranging. One illustrative example is the measurement of dimensions and profile of nanometer scale deep trenches in silicon-wafer based structures.

© 2009 The Optical Society

OCIS Codes
(120.0120) Instrumentation, measurement, and metrology : Instrumentation, measurement, and metrology
(120.3940) Instrumentation, measurement, and metrology : Metrology
(120.6650) Instrumentation, measurement, and metrology : Surface measurements, figure

T. J. Grimsley, F. Yan, C. H. Dang, S. Che, A. Antonelli, H. J. Maris, Q. Zhang, and A. V. Nurmikko, "Nanometer Metrology Using Ultrafast Optoacoustics," in Conference on Lasers and Electro-Optics/International Quantum Electronics Conference, OSA Technical Digest (CD) (Optical Society of America, 2009), paper CTuAA6.

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