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Femtosecond Bessel filaments for high aspect-ratio and taper-free micromachining of dielectrics

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Abstract

Femtosecond Bessel beams are demonstrated for high aspect ratio machining in the filamentation regime with water assistance. Taper-free microchannels and micro-trenches are demonstrated with aspect ratio up to 40 and diameters down to 2 µm.

© 2010 Optical Society of America

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