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Measurement of Solder Ball Height and Shape Defects Using a Visible Supercontinuum Based Line Scan Interferometer

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Abstract

We identify shape defects on ~300µm high solder balls by measuring the 3D profile over +/−20 degrees down the ball surface. A broadband line scan interferometer enables measurement of ball height with 125nm axial resolution.

© 2010 Optical Society of America

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