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Conference Paper
CLEO: Science and Innovations
Baltimore, Maryland United States
May 1-6, 2011
ISBN: 978-1-55752-910-7
Optical Components (CFJ)

Chip-Scale Multiple Quantum Well Based Optical Interconnects

Rohit Nair, Tian Gu, Michael Teitelbaum, Keith W. Goossen, Fouad Kiamilev, and Michael W. Haney  »View Author Affiliations


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Hybrid integration of multiple quantum well modulators with silicon is proposed for implementing chip-scale optical interconnects. Polymer waveguides with curved facets are used to couple light in and out of the MQW devices.

© 2011 OSA

OCIS Codes
(130.0250) Integrated optics : Optoelectronics
(200.4650) Optics in computing : Optical interconnects
(230.4205) Optical devices : Multiple quantum well (MQW) modulators

R. Nair, T. Gu, M. Teitelbaum, K. W. Goossen, F. Kiamilev, and M. W. Haney, "Chip-Scale Multiple Quantum Well Based Optical Interconnects," in CLEO:2011 - Laser Applications to Photonic Applications, OSA Technical Digest (CD) (Optical Society of America, 2011), paper CFJ3.

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