OSA's Digital Library

Optics InfoBase > Conference Papers > CLEO_SI > 2013 > CTu1L > Page CTu1L.7 © 2013 OSA

Conference Paper
CLEO: Science and Innovations
San Jose, California United States
June 9-14, 2013
ISBN: 978-1-55752-972-5
Photonic Integration and Interconnects (CTu1L)

On-Chip Optical Interconnect Module with 3-D Optical Path Using Guided-Wave Silicon Optical Bench

Po-Kuan Shen, Chin-Ta Chen, Sheng-Long Li, Chia-Hao Chang, Shu-Hsuan Lin, Chia-Chi Chang, Hsiao-Chin Lan, Yun-Chih Lee, and Mount-Learn Wu  »View Author Affiliations


View Full Text Article

Acrobat PDF (194 KB) Note that full-text PDFs from conferences typically contain 1-3 pages of content, some or all of which might be an abstract, summary, or miscellaneous items.

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools

  • Export Citation/Save Click for help


A guided-wave silicon optical bench with monolithic 45degree micro-reflector for 3-D integrated optical interconnect is experimentally demonstrated. Optical coupling-efficiency between VCSEL and PIN PD is -1.74dB with 10mA bias, and detector current is 1.22mA.

© 2013 OSA

OCIS Codes
(130.3120) Integrated optics : Integrated optics devices
(200.4650) Optics in computing : Optical interconnects
(130.3990) Integrated optics : Micro-optical devices

P. Shen, C. Chen, S. Li, C. Chang, S. Lin, C. Chang, H. Lan, Y. Lee, and M. Wu, "On-Chip Optical Interconnect Module with 3-D Optical Path Using Guided-Wave Silicon Optical Bench," in CLEO: 2013, OSA Technical Digest (online) (Optical Society of America, 2013), paper CTu1L.7.

Sort:  Journal  |  Reset


References are not available for this paper.

Presentation Video

OSA is a member of CrossRef.

CrossCheck Deposited