Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Fabrication and packaging tolerances of a free-space micro-optical intra-MCM interconnection module: From raytracing model to experimental evidence

Not Accessible

Your library or personal account may give you access

Abstract

We report on the design of a micro-optical pathway block to interconnect 2-D Photonic-VLSI chips. We model the impact of manufacturing and assembly errors with a tolerance analysis and verify our conclusions experimentally.

© 2000 Optical Society of America

PDF Article
More Like This
Fabrication and experimental demonstration of a muitichannel module for Intra-MCM optical interconnects

G. Verschaffelt, R. Buczynski, P. Tuteleers, P. Vynck, V. Baukens, H. Ottevaere, S. Kufner, M. Kufher, A. Hermanne, J. Genoe, D. Coppée, R. Vbunckx, P. Heremans, H. Thienpont, and I. Veretennicoff
CThG4 Conference on Lasers and Electro-Optics (CLEO:S&I) 1998

Guided-wave versus free-space pathways for optical intra-multi-chip-module interconnects: Performance simulations and design rules

V. Baukens, G. Verschaffelt, P. Tuteleers, P. Vynck, H. Ottevaere, M. Kufner, S. Kufner, H. Thienpont, I. Veretennicoff, R. Bockstaele, B. Dhoedt, and R. Baets.
LFD.5 International Optical Design Conference (IODC) 1998

Demonstration of a Monolithic Micro-Optical Bridge for Free-Space Intrachip Interconnects

H. Thienpont, G. Verschaffelt, R. Buczynski, P. Tuteleers, P. Vynck, V. Baukens, S. Kufner, M. Kufner, A. Hermanne, J. Genoe, D. Coppée, R. Vounckx, P. Heremans, and I. Veretennicoff
DTuD.5 Diffractive Optics and Micro-Optics (DOMO) 1998

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved