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Conference Paper
Frontiers in Optics
San Jose, California United States
September 16, 2007
ISBN: 1-55752-846-2
Silicon and III-V Based Optoelectronics for Optical Interconnects (FThH)

III-V/Silicon Photonics for Optical Interconnects: Bonding Technology and Integrated Devices

Gunther Roelkens, J. Brouckaert, J. Van Campenhout, D. Van Thourhout, and R. Baets

http://dx.doi.org/10.1364/FIO.2007.FThH3


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Abstract

The heterogeneous integration of III-V components and silicon-on-insulator waveguide circuits using DVS-BCB adhesive die-to-wafer bonding is presented. Advances in the fabrication of laser diodes and photodetectors in the bonded epitaxial layer structure are reported.

© 2007 Optical Society of America

OCIS Codes
(130.0130) Integrated optics : Integrated optics
(130.1750) Integrated optics : Components
(250.0250) Optoelectronics : Optoelectronics
(250.5300) Optoelectronics : Photonic integrated circuits

Citation
G. Roelkens, J. Brouckaert, J. Van Campenhout, D. Van Thourhout, and R. Baets, "III-V/Silicon Photonics for Optical Interconnects: Bonding Technology and Integrated Devices," in Frontiers in Optics 2007/Laser Science XXIII/Organic Materials and Devices for Displays and Energy Conversion, OSA Technical Digest (CD) (Optical Society of America, 2007), paper FThH3.
http://www.opticsinfobase.org/abstract.cfm?URI=FiO-2007-FThH3


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