Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • Frontiers in Optics 2007/Laser Science XXIII/Organic Materials and Devices for Displays and Energy Conversion
  • OSA Technical Digest (CD) (Optica Publishing Group, 2007),
  • paper FThH3
  • https://doi.org/10.1364/FIO.2007.FThH3

III-V/Silicon Photonics for Optical Interconnects: Bonding Technology and Integrated Devices

Not Accessible

Your library or personal account may give you access

Abstract

The heterogeneous integration of III-V components and silicon-on-insulator waveguide circuits using DVS-BCB adhesive die-to-wafer bonding is presented. Advances in the fabrication of laser diodes and photodetectors in the bonded epitaxial layer structure are reported.

© 2007 Optical Society of America

PDF Article
More Like This
III-V/Silicon Photonics: Technology and Integrated Devices

G. Roelkens, L. Liu, J. Brouckaert, J. Van Campenhout, F. Van Laere, D. Van Thourhout, and R. Baets
IMC1 Integrated Photonics and Nanophotonics Research and Applications (IPR) 2008

Continuous-Wave Lasing from DVS-BCB Heterogeneously Integrated Laser Diodes

Günther Roelkens, Dries Van Thourhout, and Roel Baets
ITuG4 Integrated Photonics and Nanophotonics Research and Applications (IPR) 2007

Heterogeneous III-V/silicon photonic integrated circuits

G. Roelkens, S. Keyvaninia, Y. De Koninck, P. Mechet, T. Spuesens, M. Tassaert, S. Stankovic, G. Morthier, R. Baets, D. Van Thourhout, F. Lelarge, G.-H. Duan, S. Messaoudene, J.M. Fedeli, T. De Vries, B. Smalbrugge, E.J. Geluk, J. Bolk, and M. Smit
ATh3A.5 Asia Communications and Photonics Conference (ACP) 2013

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved