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Conference Paper
Frontiers in Optics
San Jose, California United States
October 11-15, 2009
ISBN: 978-1-55752-878-0
Silicon Photonics II (FWN)

Electronic-Nanophotonic Integration

Yadong Wang, Qian Wang, Chongyang Liu, Ng Doris, Yongqiang Wei, Yingyan Huang, and Seng-Tiong Ho

http://dx.doi.org/10.1364/FIO.2009.FWN2


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Abstract

Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.

© 2009 OSA

OCIS Codes
(230.0230) Optical devices : Optical devices
(230.3120) Optical devices : Integrated optics devices
(250.0250) Optoelectronics : Optoelectronics
(250.5300) Optoelectronics : Photonic integrated circuits

Citation
Y. Wang, Q. Wang, C. Liu, N. Doris, Y. Wei, Y. Huang, and S. Ho, "Electronic-Nanophotonic Integration," in Frontiers in Optics 2009/Laser Science XXV/Fall 2009 OSA Optics & Photonics Technical Digest, OSA Technical Digest (CD) (Optical Society of America, 2009), paper FWN2.
http://www.opticsinfobase.org/abstract.cfm?URI=FiO-2009-FWN2


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