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Conference Paper
Integrated Photonics Research and Applications
San Diego, California United States
April 10, 2005
ISBN: 1-55752-787-3
Packaging and High-Speed Performance (IWA)

Microwave Packaging of High-Speed Semiconductor Lasers

Ning Hua Zhu, Shang Jian Zhang, Cheng Chen, Yu Liu, Chao Liu, Edwin Yu. Pun, and Po-Sheun Chung

http://dx.doi.org/10.1364/IPRA.2005.IWA1


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Abstract

Many new and different packaging types of high-speed semiconductor lasers have been developed to meet the rapidly increasing demand. This paper describes the recent progress in the microwave issues of high-speed semiconductor laser packaging.

© 2005 Optical Society of America

OCIS Codes
(060.0060) Fiber optics and optical communications : Fiber optics and optical communications
(060.4080) Fiber optics and optical communications : Modulation
(140.0140) Lasers and laser optics : Lasers and laser optics
(140.5960) Lasers and laser optics : Semiconductor lasers

Citation
N. H. Zhu, S. J. Zhang, C. Chen, Y. Liu, C. Liu, E. Y. Pun, and P. Chung, " Microwave Packaging of High-Speed Semiconductor Lasers," in Integrated Photonics Research and Applications/Nanophotonics for Information Systems, Technical Digest (Optical Society of America, 2005), paper IWA1.
http://www.opticsinfobase.org/abstract.cfm?URI=IPRA-2005-IWA1


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