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Conference Paper
Integrated Photonics Research, Silicon and Nanophotonics
Colorado Springs, Colorado United States
June 17-20, 2012
ISBN: 978-1-55752-946-6
Integration of Silicon Photonics with Other Technologies (ITu4B)

Hybrid Si/III-V Devices for Optical Interconnects

John E. Bowers, Martijn J. Heck, Yongbo Tang, and Siddharth Jain  »View Author Affiliations


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A hybrid silicon integrated broadband (60 nm) DFB array and high-speed modulator (50 Gbps) are presented, showing the potential of this technology for future transmitters in optical interconnects.

© 2012 OSA

OCIS Codes
(140.2020) Lasers and laser optics : Diode lasers
(200.4650) Optics in computing : Optical interconnects
(230.4110) Optical devices : Modulators

J. E. Bowers, M. J. Heck, Y. Tang, and S. Jain, "Hybrid Si/III-V Devices for Optical Interconnects," in Advanced Photonics Congress, OSA Technical Digest (online) (Optical Society of America, 2012), paper ITu4B.1.

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