In this work, we present a thermal distribution measurement and analysis on the surface area of a Ball Grid Array (BGA), soldered by means of a Focused Infrared Light Soldering System (FILSS), which meets the BGA surface mount device (SMD) reflow solder heating profile
© 2012 OSA
(000.3110) General : Instruments, apparatus, and components common to the sciences
(110.3080) Imaging systems : Infrared imaging
(120.4820) Instrumentation, measurement, and metrology : Optical systems
M. Felix, C. Anguiano, A. Medel, M. Bravo, D. Salazar, H. Marquez, and J. Chacon, "Infrared thermography of integrated circuits heated by focused IR light soldering system," in Latin America Optics and Photonics Conference, OSA Technical Digest (online) (Optical Society of America, 2012), paper LT4C.3.
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