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Conferences > LAOP > 2012 > LT4C > LT4C.3

Infrared thermography of integrated circuits heated by focused IR light soldering system

M. Félix, C. Anguiano, A. Medel, M. Bravo, J. Chacon, D. Salazar, and H. Márquez

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Abstract

In this work, we present a thermal distribution measurement and analysis on the surface area of a Ball Grid Array (BGA), soldered by means of a Focused Infrared Light Soldering System (FILSS), which meets the BGA surface mount device (SMD) reflow solder heating profile.

© 2012 Optical Society of America

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