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Conference Paper
Latin America Optics and Photonics Conference
Sao Sebastiao Brazil
November 10-13, 2012
ISBN: 978-1-55752-9589
Terahertz and Heat (LT4C)

Infrared thermography of integrated circuits heated by focused IR light soldering system

Marco Felix, Citlalli Anguiano, Andres Medel, Miguel Bravo, David Salazar, Heriberto Marquez, and J. Chacon  »View Author Affiliations


http://dx.doi.org/10.1364/LAOP.2012.LT4C.3


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Abstract

In this work, we present a thermal distribution measurement and analysis on the surface area of a Ball Grid Array (BGA), soldered by means of a Focused Infrared Light Soldering System (FILSS), which meets the BGA surface mount device (SMD) reflow solder heating profile

© 2012 OSA

OCIS Codes
(000.3110) General : Instruments, apparatus, and components common to the sciences
(110.3080) Imaging systems : Infrared imaging
(120.4820) Instrumentation, measurement, and metrology : Optical systems

Citation
M. Felix, C. Anguiano, A. Medel, M. Bravo, D. Salazar, H. Marquez, and J. Chacon, "Infrared thermography of integrated circuits heated by focused IR light soldering system," in Latin America Optics and Photonics Conference, OSA Technical Digest (online) (Optical Society of America, 2012), paper LT4C.3.
http://www.opticsinfobase.org/abstract.cfm?URI=LAOP-2012-LT4C.3


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