Abstract

Compound semiconductor nanowires are emerging as attractive and versatile building blocks for the “bottom-up” assembly of photonic devices¹, including photodectors², light-emitting diodes (LEDs)^3-5, and lasers⁶. The ability to assemble and electrically interconnect these building blocks is especially critical since it represents a unique approach to active multi-color device components on a single chip unlike the conventional technologies.

© 2005 Optical Society of America