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Conference Paper
Optics in Computing
Washington, D.C. United States
June 15, 2003
ISBN: 1-55752-750-4
IPR/OC Joint Session on Nanofabrication Technologies (JWC)

Microresonator fabrication and integration for high density chip to chip optical interconnect

Ronald M. Kubacki


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Microresonators, while difficult to fabricate, present significant opportunity for photonic integration. We present a material set/fabrication process to produce high precision resonator structures and integrate them with CMOS silicon devices for ultra-dense optical chip interconnect.

© 2003 Optical Society of America

OCIS Codes
(200.4650) Optics in computing : Optical interconnects
(230.5750) Optical devices : Resonators

R. M. Kubacki, "Microresonator fabrication and integration for high density chip to chip optical interconnect," in Optics in Computing, A. Sawchuk, ed., Vol. 90 of OSA Trends in Optics and Photonics (Optical Society of America, 2003), paper JWC4.

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