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Optica Publishing Group
  • Optical Fiber Communications Conference
  • OSA Trends in Optics and Photonics (Optica Publishing Group, 2002),
  • paper WS7

Packaging of micro-optic components to meet Telcordia standards

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Abstract

Telecom packages are constrained by design, process and reliability requirements that are often mutually conflicting. While excellent theoretical, numerical, and experimental tools are available for design and process optimization, there are few analogous methods for creating products with a specified reliability. Without these quantitative design tools, expensive “cut-and-try” cycles are required to balance reliability requirements versus those of design and process. These cycles are particularly expensive when Telcordia1 qualification tests (or similar customer-specific tests) are the measure of reliability. The lack of predictive models for these quality requirements is therefore a major obstacle to rapid development of new products.

© 2002 Optical Society of America

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