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  • Optical Fiber Communication Conference and Exposition and The National Fiber Optic Engineers Conference
  • Technical Digest (CD) (Optica Publishing Group, 2005),
  • paper OFD6

Polymeric Optical Interconnect for Chip-to-Chip Communication

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Abstract

An optical interconnect has been produced on FR-4 board. The interconnect consists of photo-defined optical layers coupled to VCSELs and photodetectors via out of plane mirrors. Materials, fabrication methods and test results will be discussed.

© 2005 Optical Society of America

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