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Conference Paper
Optical Fiber Communication Conference
San Diego, California United States
March 21-25, 2010
ISBN: 978-1-55752-885-8
Beyond Telecom and Datacom Symposium II (OMV)

The Transition to Chip Level Optical Interconnects

Mike Haney, Daniel K. Sparacin, and Justin Hodiak

http://dx.doi.org/10.1364/OFC.2010.OMV2


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Abstract

The increasing bandwidth demands of computing chips have spawned significant research into chip-scale photonic interconnects. We review the DARPA-sponsored efforts at the inter- and intra-chip interconnect domains and highlight the key challenges to be addressed.

© 2010 IEEE Communications Society, IEEE Photonics Society, OSA, Telcordia

OCIS Codes
(200.0200) Optics in computing : Optics in computing
(200.4650) Optics in computing : Optical interconnects
(250.0250) Optoelectronics : Optoelectronics
(250.5300) Optoelectronics : Photonic integrated circuits

Citation
M. Haney, D. K. Sparacin, and J. Hodiak, "The Transition to Chip Level Optical Interconnects," in Optical Fiber Communication Conference, OSA Technical Digest (CD) (Optical Society of America, 2010), paper OMV2.
http://www.opticsinfobase.org/abstract.cfm?URI=OFC-2010-OMV2


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