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Conference Paper
Optical Fiber Communication Conference
Los Angeles, California United States
March 6-10, 2011
ISBN: 978-1-55752-906-0
Photonic Interconnect (OThQ)

Optical I/O for Chip-to-Chip Interconnects on CMOS Platform

Peter L. Chang, Edris Mohammed, Bruce Block, Miriam R. Reshotko, and Ian A. Young  »View Author Affiliations


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Optical devices on CMOS die and package for terabit computing are discussed. 200Gbps transmission is accomplished with a 1x10 VCSEL array. CMOS backend compatible modulators and photodetectors are demonstrated at 40Gbps for on-die integration.

© 2011 OSA

OCIS Codes
(200.4650) Optics in computing : Optical interconnects
(250.5300) Optoelectronics : Photonic integrated circuits
(130.6622) Integrated optics : Subsystem integration and techniques

P. L. Chang, E. Mohammed, B. Block, M. R. Reshotko, and I. A. Young, "Optical I/O for Chip-to-Chip Interconnects on CMOS Platform," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011, OSA Technical Digest (CD) (Optical Society of America, 2011), paper OThQ1.

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