Optical devices on CMOS die and package for terabit computing are discussed. 200Gbps transmission is accomplished with a 1x10 VCSEL array. CMOS backend compatible modulators and photodetectors are demonstrated at 40Gbps for on-die integration.
© 2011 OSA
P. L. Chang, E. Mohammed, B. Block, M. R. Reshotko, and I. A. Young, "Optical I/O for Chip-to-Chip Interconnects on CMOS Platform," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011, OSA Technical Digest (CD) (Optical Society of America, 2011), paper OThQ1.