OSA's Digital Library

Optics InfoBase > Conference Papers > OFC > 2011 > OWZ > Page OWZ6 © 2011 OSA

Conference Paper
Optical Fiber Communication Conference
Los Angeles, California United States
March 6-10, 2011
ISBN: 978-1-55752-906-0
Silicon Photonics II (OWZ)

Reduction of hybrid silicon laser thermal impedance using Poly Si thermal shunts

Matthew Sysak, Hyundai Park, Alexander Fang, Omri Raday, John Bowers, and Richard Jones  »View Author Affiliations


http://dx.doi.org/10.1364/OFC.2011.OWZ6


View Full Text Article

Acrobat PDF (283 KB) Note that full-text PDFs from conferences typically contain 1-3 pages of content, some or all of which might be an abstract, summary, or miscellaneous items.





Browse Journals / Lookup Meetings

Browse by Journal and Year


   


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools

Share
Citations
  • Export Citation/Save Click for help

Abstract

We present a hybrid silicon evanescent laser that uses poly-silicon thermal shunts to reduce the device thermal impedance from 41.5 to 33.5 deg. C/W.

© 2011 OSA

OCIS Codes
(140.0140) Lasers and laser optics : Lasers and laser optics
(230.0230) Optical devices : Optical devices
(250.0250) Optoelectronics : Optoelectronics

Citation
M. Sysak, H. Park, A. Fang, O. Raday, J. Bowers, and R. Jones, "Reduction of hybrid silicon laser thermal impedance using Poly Si thermal shunts," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011, OSA Technical Digest (CD) (Optical Society of America, 2011), paper OWZ6.
http://www.opticsinfobase.org/abstract.cfm?URI=OFC-2011-OWZ6


Sort:  Journal  |  Reset

References

References are not available for this paper.

OSA is a member of CrossRef.

CrossCheck Deposited