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Conference Paper
Optical Fiber Communication Conference
Los Angeles, California United States
March 6-10, 2011
ISBN: 978-1-55752-906-0
Silicon Photonics II (OWZ)

Reduction of hybrid silicon laser thermal impedance using Poly Si thermal shunts

Matthew Sysak, Hyundai Park, Alexander Fang, Omri Raday, John Bowers, and Richard Jones  »View Author Affiliations


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We present a hybrid silicon evanescent laser that uses poly-silicon thermal shunts to reduce the device thermal impedance from 41.5 to 33.5 deg. C/W.

© 2011 OSA

OCIS Codes
(140.0140) Lasers and laser optics : Lasers and laser optics
(230.0230) Optical devices : Optical devices
(250.0250) Optoelectronics : Optoelectronics

M. Sysak, H. Park, A. Fang, O. Raday, J. Bowers, and R. Jones, "Reduction of hybrid silicon laser thermal impedance using Poly Si thermal shunts," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011, OSA Technical Digest (CD) (Optical Society of America, 2011), paper OWZ6.

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