We present a hybrid silicon evanescent laser that uses poly-silicon thermal shunts to reduce the device thermal impedance from 41.5 to 33.5 deg. C/W.
© 2011 OSA
M. Sysak, H. Park, A. Fang, O. Raday, J. Bowers, and R. Jones, "Reduction of hybrid silicon laser thermal impedance using Poly Si thermal shunts," in Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011, OSA Technical Digest (CD) (Optical Society of America, 2011), paper OWZ6.
References are not available for this paper.