Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability

Tymon Barwicz; Yoichi Taira; Ted W. Lichoulas; Nicolas Boyer; Hidetoshi Numata; Yves Martin; Jae-Woong Nah; Shotaro Takenobu; Alexander Janta-Polczynski; Eddie L. Kimbrell; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Sebastian Engelmann; Yurii A. Vlasov; Paul Fortier

doi:10.1364/OFC.2015.W3H.4

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper W3H.4
•https://doi.org/10.1364/OFC.2015.W3H.4

Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, and Paul Fortier

Optical Fiber Communication Conference 2015

Los Angeles, California United States
22–26 March 2015
ISBN: 978-1-55752-937-4

From the session
Beyond the Gold Box: The Future of Integrated Optics II (W3H)

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T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, H. Numata, Y. Martin, J. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, "Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper W3H.4.

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Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

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