Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Optomechanical design and characterization of a printed-circuit-board-based free-space optical interconnect package

Not Accessible

Your library or personal account may give you access

Abstract

We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI’s) can be integrated simply on electronic multichip modules (MCM’s) for intra-MCM–board interconnects. Our system-level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than -20 dB at low frequency have been measured. The system is compact at only 10 in.3 (25.4 cm3) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

© 1999 Optical Society of America

Full Article  |  PDF Article
More Like This
Free-space parallel multichip interconnection system

Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, and Sadik C. Esener
Appl. Opt. 39(20) 3516-3524 (2000)

Multichip free-space global optical interconnection demonstration with integrated arrays of vertical-cavity surface-emitting lasers and photodetectors

Michael W. Haney, Marc P. Christensen, Predrag Milojkovic, Jeremy Ekman, Premanand Chandramani, Richard Rozier, Fouad Kiamilev, Yue Liu, and Mary Hibbs-Brenner
Appl. Opt. 38(29) 6190-6200 (1999)

Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks

Guoqiang Li, Dawei Huang, Emel Yuceturk, Philippe J. Marchand, Sadik C. Esener, Volkan H. Ozguz, and Yue Liu
Appl. Opt. 41(2) 348-360 (2002)

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Figures (12)

You do not have subscription access to this journal. Figure files are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Tables (2)

You do not have subscription access to this journal. Article tables are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Equations (1)

You do not have subscription access to this journal. Equations are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved