Effect of Vaporization and Melt Ejection on Laser Machining of Silica Glass Micro-Optical Components
Applied Optics, Vol. 41, Issue 27, pp. 5660-5667 (2002)
http://dx.doi.org/10.1364/AO.41.005660
Acrobat PDF (1742 KB)
Abstract
A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5–100-μs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-μs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 μs is identified for low-threshold, smooth machining without melt displacement and ejection effects.
© 2002 Optical Society of America
OCIS Codes
(140.3390) Lasers and laser optics : Laser materials processing
(140.3470) Lasers and laser optics : Lasers, carbon dioxide
(160.0160) Materials : Materials
(160.6030) Materials : Silica
(220.0220) Optical design and fabrication : Optical design and fabrication
(220.4000) Optical design and fabrication : Microstructure fabrication
Citation
Gavin A. J. Markillie, Howard J. Baker, Francisco J. Villarreal, and Denis R. Hall, "Effect of Vaporization and Melt Ejection on Laser Machining of Silica Glass Micro-Optical Components," Appl. Opt. 41, 5660-5667 (2002)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-41-27-5660
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