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Applied Optics

Applied Optics


  • Vol. 41, Iss. 8 — Mar. 10, 2002
  • pp: 1541–1555

Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications

Frederic Lacroix, Eric Bernier, Michael H. Ayliffe, Frank A. P. Tooley, David V. Plant, and Andrew G. Kirk  »View Author Affiliations

Applied Optics, Vol. 41, Issue 8, pp. 1541-1555 (2002)

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We report on the implementation of a dense 512-beam free-space optical interconnect linking four optoelectronic VLSI chips at the backplane level. The system presented maximizes the positioning tolerances of the components by use of slow f-number (f/16) Gaussian beams and oversized apertures. A beam-clustering scheme whereby a 4 × 4 array of beams is transmitted by each minilens is used to provide a high channel density. A modular approach is used to decrease the number of degrees of freedom in the system and achieve passive alignment of the modules in the final integration phase. A design overview as well as assembly and experimental results are presented.

© 2002 Optical Society of America

OCIS Codes
(200.2610) Optics in computing : Free-space digital optics
(200.4650) Optics in computing : Optical interconnects
(200.4880) Optics in computing : Optomechanics

Original Manuscript: March 15, 2001
Revised Manuscript: November 26, 2001
Published: March 10, 2002

Frederic Lacroix, Eric Bernier, Michael H. Ayliffe, Frank A. P. Tooley, David V. Plant, and Andrew G. Kirk, "Implementation of a compact, four-stage, scalable optical interconnect for photonic backplane applications," Appl. Opt. 41, 1541-1555 (2002)

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