Implementation of a Compact, Four-Stage, Scalable Optical Interconnect for Photonic Backplane Applications
Applied Optics, Vol. 41, Issue 8, pp. 1541-1555 (2002)
http://dx.doi.org/10.1364/AO.41.001541
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Abstract
We report on the implementation of a dense 512-beam free-space optical interconnect linking four optoelectronic VLSI chips at the backplane level. The system presented maximizes the positioning tolerances of the components by use of slow f-number (f/16) Gaussian beams and oversized apertures. A beam-clustering scheme whereby a 4 × 4 array of beams is transmitted by each minilens is used to provide a high channel density. A modular approach is used to decrease the number of degrees of freedom in the system and achieve passive alignment of the modules in the final integration phase. A design overview as well as assembly and experimental results are presented.
© 2002 Optical Society of America
[Optical Society of America ]
OCIS Codes
(200.2610) Optics in computing : Free-space digital optics
(200.4650) Optics in computing : Optical interconnects
(200.4880) Optics in computing : Optomechanics
Citation
Frederic Lacroix, Eric Bernier, Michael H. Ayliffe, Frank A. P. Tooley, David V. Plant, and Andrew G. Kirk, "Implementation of a Compact, Four-Stage, Scalable Optical Interconnect for Photonic Backplane Applications," Appl. Opt. 41, 1541-1555 (2002)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-41-8-1541
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