Effect of mask-roughness on printed contact-size variation in extreme-ultraviolet lithography
Applied Optics, Vol. 44, Issue 2, pp. 183-189 (2005)
http://dx.doi.org/10.1364/AO.44.000183
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Abstract
Relying on reflective mask technology, extreme-ultraviolet (EUV) lithography is particularly vulnerable to mask substrate roughness. Previous research has shown mask roughness to play a significant role in printed line-edge roughness (LER). Here the analysis of mask-roughness effects is extended to printed contact-size variations. Unlike LER, illumination partial coherence is found to have little affect on the results for contacts that are near the diffraction limit. Analysis shows that, given the current state-of-the-art EUV mask, mask roughness has a significant effect on the process window for small contacts. The analysis also shows that a significant portion of the contact-size variation observed in recent 0.1-numerical-aperture EUV exposures can be attributed to the mask-roughness effect studied here.
© 2005 Optical Society of America
OCIS Codes
(030.5770) Coherence and statistical optics : Roughness
(030.6140) Coherence and statistical optics : Speckle
(110.3960) Imaging systems : Microlithography
(110.4980) Imaging systems : Partial coherence in imaging
(260.7200) Physical optics : Ultraviolet, extreme
Citation
Patrick P. Naulleau, "Effect of mask-roughness on printed contact-size variation in extreme-ultraviolet lithography," Appl. Opt. 44, 183-189 (2005)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-44-2-183
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