Illumination system for wire bonding inspection
Applied Optics, Vol. 46, Issue 6, pp. 845-854 (2007)
http://dx.doi.org/10.1364/AO.46.000845
Enhanced HTML 
Acrobat PDF (1967 KB)
Abstract
A novel lighting system was devised for 3D defect inspection in the wire bondingprocess. Gold wires of 20 μm in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. The 3D-type bonding wire defects are sagging wires, and are difficult to inspect from a 2D top-view image. A structured lighting system was designed and developed to facilitate all 2D-type and 3D-type defect inspection. The devised lighting system can be programmed to turn the structured LEDs on or off independently. Experiments show that the devised illumination system is effective for wire bonding inspection and will be valuable for further applications.
© 2007 Optical Society of America
OCIS Codes
(120.4630) Instrumentation, measurement, and metrology : Optical inspection
(150.3040) Machine vision : Industrial inspection
ToC Category:
Machine Vision
History
Original Manuscript: June 15, 2006
Revised Manuscript: October 18, 2006
Manuscript Accepted: October 18, 2006
Published: February 2, 2007
Citation
Der-Baau Perng, Cheng-Chuan Chou, and Shu-Ming Lee, "Illumination system for wire bonding inspection," Appl. Opt. 46, 845-854 (2007)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-46-6-845
You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Log in to access OSA Member Subscription
You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Log in to access OSA Member Subscription
You do not have subscription access to this journal. Figure files are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Log in to access OSA Member Subscription
You do not have subscription access to this journal. Article level metrics are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.
Contact your librarian or system administrator
or
Log in to access OSA Member Subscription
Related Journal Articles 
- Measurement of surface orientations of transparent objects by use of polarization in highlight (JOSAA)
- Polarized light-scattering measurements of dielectric spheres upon a silicon surface (OL)
- Enhancement of surface inspection by Moiré interferometry using flexible reference gratings (OE)
- Noncontact interferometric optical probe for calibration of coordinate measuring machines (AO)
- Efficient gonio-imaging of optically variable devices by compound-eye image-capturing system (OE)
Related Conference Papers
- Application of a 2W/nm All-Fiber Supercontinuum Source to the Characterization of Nonlinear Crystals
- Application of a 2W/nm All-Fiber Supercontinuum Source to the Characterization of Nonlinear Crystals
- Seeing inside chips and cells: High-resolution subsurface imaging of integrated circuits, quantum dots and subcellular structures
- Optical specifications--their role inthe National Ignition Facility
- Infrared Shack-Hartmann wavefront sensor for conformal dome metrology
« Previous Article | Next Article »
OSA is a member of 