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Applied Optics

Applied Optics


  • Editor: James C. Wyant
  • Vol. 46, Iss. 6 — Feb. 20, 2007
  • pp: 845–854

Illumination system for wire bonding inspection

Der-Baau Perng, Cheng-Chuan Chou, and Shu-Ming Lee  »View Author Affiliations

Applied Optics, Vol. 46, Issue 6, pp. 845-854 (2007)

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A novel lighting system was devised for 3D defect inspection in the wire bondingprocess. Gold wires of 20 μm in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. The 3D-type bonding wire defects are sagging wires, and are difficult to inspect from a 2D top-view image. A structured lighting system was designed and developed to facilitate all 2D-type and 3D-type defect inspection. The devised lighting system can be programmed to turn the structured LEDs on or off independently. Experiments show that the devised illumination system is effective for wire bonding inspection and will be valuable for further applications.

© 2007 Optical Society of America

OCIS Codes
(120.4630) Instrumentation, measurement, and metrology : Optical inspection
(150.3040) Machine vision : Industrial inspection

ToC Category:
Machine Vision

Original Manuscript: June 15, 2006
Revised Manuscript: October 18, 2006
Manuscript Accepted: October 18, 2006
Published: February 2, 2007

Der-Baau Perng, Cheng-Chuan Chou, and Shu-Ming Lee, "Illumination system for wire bonding inspection," Appl. Opt. 46, 845-854 (2007)

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