Optical interconnections made using two-dimensional arrays of top-surface-emitting microlasers and integrated free-space optics are discussed for use in chip-to-chip communications. A demonstration setup with a 2 × 2 array of lasers is presented. System parameters, such as light efficiency, the number of data channels, thermal effects, power requirements, and the issue of hybrid integration of laser chips with passive optics, are considered.
© 1992 Optical Society of America
Original Manuscript: December 11, 1990
Published: February 10, 1992
Jürgen Jahns, Yong H. Lee, Charles A. Burrus, and Jack L. Jewell, "Optical interconnects using top-surface-emitting microlasers and planar optics," Appl. Opt. 31, 592-597 (1992)