Jan Haisma, Bert A. C. M. Spierings, Udo K. P. Biermann, and Aart A. van Gorkum, "Diversity and feasibility of direct bonding: a survey of a dedicated optical technology," Appl. Opt. 33, 1154-1169 (1994)
The aim of this paper is to review almost a decade of direct-bonding activities at Philips Research including the diversity and feasibility of direct bonding. The bondability of a material is determined by its geometrical shape and mechanical, physical, and chemical surface states. Physically direct bonding provides a vacuumtight bond, which is jointless and glueless, and it permits engineering of the interfaces to be bonded. Layers can be buried, and reflective–lossless bonds between optical elements can be created. A variety of materials are investigated: (refractory) metals, a semimetal, boron, diamond, a carbide, fluorides, nitrides, oxides, and a chalcogenide. The applications that we describe relate to interface engineering, waveguiding, and the direct bonding of a fiber plate.
Jan Haisma, Frank J. H. M. van der Kruis, Bert A. C. M. Spierings, Jan Jaap Baalbergen, Bart H. Bijsterveld, Ruud Brehm, Jan H. P. M. Faasen, Jan. J. C. Groenen, Peter W. de Haas, Theo B. J. Haddeman, Theo M. Michielsen, and Jaap Vijfvinkel Appl. Opt. 33(34) 7945-7954 (1994)
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Spontaneously, simply by laying down a wafer on a wafer, one realizes a contact, and bonding proceeds without intervention.
No, a bond is seen to be formed under pressure by hand, but as soon as the pressure is released, the bond disappears.
Very well, a tight bond is realized by intervention (pressure by hand); the bond front proceeds well.
Reasonably, a tight bond is formed under pressure by hand only.
Moderately, a bond is formed under pressure by hand; it is not a tight bond.
Very weakly, a bond is formed under pressure; the bond is very weak.
Perfectly, a first contact has to be brought about by some pressure by hand, and thereafter bonding proceeds without intervention.
Very hesitatingly, a local weak bond is formed under pressure by hand but not over a large area.
Absolutely not, even under pressure by hand no bonding phenomena are seen.
Table 2
Polishing Experiments on Superconductive YBa2Cu3O7–δ
Number
Polishing Medium
Polishing Pad
Pressure
Mechanical Surface State
1
Al2O3 grains (0.3 μm in diameter) suspended in ethylene glycol
Pan W (Hartfelt & Company, Denmark)
<100 g/cm2
Reasonable but not sufficient for DB
2
Al2O3 grains (0.3 μm in diameter) in glycerine
IC 60 (Rodel)
<100 g/cm2
Orange peel
3
Al2O3 grains (0.3 μm in diameter) in dry methanol
IC 60
≈50 g/cm2
Mat
≈1000 g/cm2
4
Al2O3 grains (0.3 μm in diameter) in ethylene glycol
IC 60
≈100 g/cm2
Reasonable but not bondable
5
Al2O3 grains (0.3 μm in diameter) in ethylene glycol
PSA 750 (Rodel)
0.1–1.0 kg/cm2
Rough surface finish
6
Al2O3 grains (0.3 μm in diameter) in ethylene glycol
Black pitch
100–500 g/cm2
Susceptible to DB
Table 3
Overview of Roughness and Imperfection Measurements on Synthetic Monocrystalline Diamond
Type of Measurement
Rmax of the Mechanically Polished Side: Peak–Valley Value
Rmax of the Tribochemical Polished Side: Peak–Valley Value
Spontaneously, simply by laying down a wafer on a wafer, one realizes a contact, and bonding proceeds without intervention.
No, a bond is seen to be formed under pressure by hand, but as soon as the pressure is released, the bond disappears.
Very well, a tight bond is realized by intervention (pressure by hand); the bond front proceeds well.
Reasonably, a tight bond is formed under pressure by hand only.
Moderately, a bond is formed under pressure by hand; it is not a tight bond.
Very weakly, a bond is formed under pressure; the bond is very weak.
Perfectly, a first contact has to be brought about by some pressure by hand, and thereafter bonding proceeds without intervention.
Very hesitatingly, a local weak bond is formed under pressure by hand but not over a large area.
Absolutely not, even under pressure by hand no bonding phenomena are seen.
Table 2
Polishing Experiments on Superconductive YBa2Cu3O7–δ
Number
Polishing Medium
Polishing Pad
Pressure
Mechanical Surface State
1
Al2O3 grains (0.3 μm in diameter) suspended in ethylene glycol
Pan W (Hartfelt & Company, Denmark)
<100 g/cm2
Reasonable but not sufficient for DB
2
Al2O3 grains (0.3 μm in diameter) in glycerine
IC 60 (Rodel)
<100 g/cm2
Orange peel
3
Al2O3 grains (0.3 μm in diameter) in dry methanol
IC 60
≈50 g/cm2
Mat
≈1000 g/cm2
4
Al2O3 grains (0.3 μm in diameter) in ethylene glycol
IC 60
≈100 g/cm2
Reasonable but not bondable
5
Al2O3 grains (0.3 μm in diameter) in ethylene glycol
PSA 750 (Rodel)
0.1–1.0 kg/cm2
Rough surface finish
6
Al2O3 grains (0.3 μm in diameter) in ethylene glycol
Black pitch
100–500 g/cm2
Susceptible to DB
Table 3
Overview of Roughness and Imperfection Measurements on Synthetic Monocrystalline Diamond
Type of Measurement
Rmax of the Mechanically Polished Side: Peak–Valley Value
Rmax of the Tribochemical Polished Side: Peak–Valley Value