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Applied Optics

Applied Optics

APPLICATIONS-CENTERED RESEARCH IN OPTICS

  • Vol. 37, Iss. 14 — May. 10, 1998
  • pp: 2944–2952

Plastic Modules for Free-Space Optical Interconnects

David T. Neilson and Eugen Schenfeld  »View Author Affiliations


Applied Optics, Vol. 37, Issue 14, pp. 2944-2952 (1998)
http://dx.doi.org/10.1364/AO.37.002944


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Abstract

A combined optoelectronic and optomechanical packaging technique for the construction of snap-together free-space optical interconnect systems is described. The modules integrate relaying and routing functions by use of transparent optical molded plastic, which can achieve sufficient alignment precision that further adjustment is not required during system assembly. Methods to integrate the optoelectronic chips, such as vertical-cavity surface-emitting laser and receiver arrays with these plastic optical modules are described. Other chips can also be integrated to form optoelectronic multichip modules. These modules can also be designed to accommodate coupling to or from optical fiber arrays. A test-bed system to demonstrate the concept was assembled to a lower precision by use of conventional machining techniques.

© 1998 Optical Society of America

OCIS Codes
(060.4250) Fiber optics and optical communications : Networks
(060.4510) Fiber optics and optical communications : Optical communications
(200.2610) Optics in computing : Free-space digital optics
(200.4650) Optics in computing : Optical interconnects
(200.4880) Optics in computing : Optomechanics
(200.4960) Optics in computing : Parallel processing
(250.3140) Optoelectronics : Integrated optoelectronic circuits
(250.7260) Optoelectronics : Vertical cavity surface emitting lasers

Citation
David T. Neilson and Eugen Schenfeld, "Plastic Modules for Free-Space Optical Interconnects," Appl. Opt. 37, 2944-2952 (1998)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-37-14-2944

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