Transient Deformation Analysis by a Carrier Method of Pulsed Electronic Speckle-Shearing Pattern Interferometry
Applied Optics, Vol. 37, Issue 19, pp. 4116-4122 (1998)
http://dx.doi.org/10.1364/AO.37.004116
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Abstract
The introduction of a pulsed laser into an electronic speckle-shearing pattern interferometer allows high-speed transient deformations to be measured. We report on a computerized system that permits automatic data reduction by introducing carrier fringes through the translation of a diverging lens. The quantitative determination of the phase map that is due to deformation is carried out by the spatial synchronous detection method. Experimental results obtained for a metal plate transiently deformed by an electromagnetic hammer illustrate the advantages of the proposed system.
© 1998 Optical Society of America
OCIS Codes
(120.2650) Instrumentation, measurement, and metrology : Fringe analysis
(120.3180) Instrumentation, measurement, and metrology : Interferometry
(120.6150) Instrumentation, measurement, and metrology : Speckle imaging
(140.0140) Lasers and laser optics : Lasers and laser optics
Citation
Abundio Dávila, Guillermo H. Kaufmann, and Carlos Pérez-López, "Transient Deformation Analysis by a Carrier Method of Pulsed Electronic Speckle-Shearing Pattern Interferometry," Appl. Opt. 37, 4116-4122 (1998)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-37-19-4116
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