We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI’s) can be integrated simply on electronic multichip modules (MCM’s) for intra-MCM—board interconnects. Our system-level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than −20 dB at low frequency have been measured. The system is compact at only 10 in.3 (25.4 cm3) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.
© 1999 Optical Society of America
(130.0130) Integrated optics : Integrated optics
(200.2610) Optics in computing : Free-space digital optics
(200.4650) Optics in computing : Optical interconnects
(200.4880) Optics in computing : Optomechanics
Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Osman Kibar, Nur S. E. Ozkan, and Sadik C. Esener, "Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package," Appl. Opt. 38, 5631-5640 (1999)