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Applied Optics

Applied Optics

APPLICATIONS-CENTERED RESEARCH IN OPTICS

  • Vol. 38, Iss. 35 — Dec. 11, 1999
  • pp: 7264–7275

Comparison of fully three-dimensional optical, normally conducting, and superconducting interconnections

Haldun M. Ozaktas and M. Fatih Erden  »View Author Affiliations


Applied Optics, Vol. 38, Issue 35, pp. 7264-7275 (1999)
http://dx.doi.org/10.1364/AO.38.007264


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Abstract

Several approaches to three-dimensional integration of conventional electronic circuits have been pursued recently. To determine whether the advantages of optical interconnections are negated by these advances, we compare the limitations of fully three-dimensional systems interconnected with optical, normally conducting, repeatered normally conducting, and superconducting interconnections by showing how system-level parameters such as signal delay, bandwidth, and number of computing elements are related. In particular, we show that the duty ratio of pulses transmitted on terminated transmission lines is an important optimization parameter that can be used to trade off signal delay and bandwidth so as to optimize applicable measures of performance or cost, such as minimum message delay in parallel computation.

© 1999 Optical Society of America

OCIS Codes
(200.0200) Optics in computing : Optics in computing
(200.4650) Optics in computing : Optical interconnects

History
Original Manuscript: July 7, 1998
Revised Manuscript: August 30, 1999
Published: December 10, 1999

Citation
Haldun M. Ozaktas and M. Fatih Erden, "Comparison of fully three-dimensional optical, normally conducting, and superconducting interconnections," Appl. Opt. 38, 7264-7275 (1999)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-38-35-7264


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References

  1. IEEE, eds., Proceedings of the 45th Electronic Components and Technology Conference (ECTC) (Institute of Electrical and Electronics Engineers, Piscataway, N.J., 1995).
  2. H. M. Ozaktas, J. W. Goodman, “The limitations of interconnections in providing communication between an array of points,” in Frontiers of Computing Systems Research, S. K. Tewksbury, ed. (Plenum, New York, 1991), Vol. 2, pp. 61–130. [CrossRef]
  3. H. M. Ozaktas, “A physical approach to communication limits in computation,” Ph.D. dissertation (Stanford University, Stanford, Calif., 1991).
  4. A. L. Rosenberg, “Three-dimensional VLSI: a case study,” J. Assoc. Comput. Mach. 30, 397–416 (1983). [CrossRef]
  5. F. T. Leighton, A. L. Rosenberg, “Three-dimensional circuit layouts,” J. Comput. Sys. Sci. 15, 793–813 (1986).
  6. M. J. Little, J. Grinberg, “The 3-D computer: an integrated stack of WSI wafers,” in Wafer-Scale Integration (Kluwer, New York, 1988), Chap. 8.
  7. H. M. Ozaktas, Y. Amitai, J. W. Goodman, “A three dimensional optical interconnection architecture with minimal growth rate of system size,” Opt. Commun.85, 1–4 (1991); errata 88, 569 (1992).
  8. H. M. Ozaktas, J. W. Goodman, “Lower bound for the communication volume required for an optically interconnected array of points,” J. Opt. Soc. Am. A 7, 2100–2106 (1990). [CrossRef]
  9. H. M. Ozaktas, Y. Amitai, J. W. Goodman, “Comparison of system size for some optical interconnection architectures and the folded multi-facet architecture,” Opt. Commun. 82, 225–228 (1991). [CrossRef]
  10. H. M. Ozaktas, D. Mendlovic, “Multistage optical interconnection architectures with least possible growth of system size,” Opt. Lett. 18, 296–298 (1993). [CrossRef]
  11. K. W. Goossen, J. E. Cunningham, W. Y. Jan, “GaAs 850 modulators solder-bonded to silicon,” IEEE Photonics Technol. Lett. 5, 776–778 (1993). [CrossRef]
  12. K. W. Goossen, J. A. Walker, L. A. D’Asaro, S. P. Hui, B. Tseng, R. Leibenguth, D. Kossives, D. D. Bacon, D. Dahringer, L. M. F. Chirovsky, A. L. Lentine, D. A. B. Miller, “GaAs MQW modulators integrated with silicon CMOS,” IEEE Photonics Technol. Lett. 7, 360–362 (1995). [CrossRef]
  13. H. M. Ozaktas, “Paradigms of connectivity for computer circuits and networks,” Opt. Eng. 31, 1563–1567 (1992). [CrossRef]
  14. H. M. Ozaktas, H. Oksuzoglu, R. F. W. Pease, J. W. Goodman, “Effect on scaling of heat removal requirements inthree-dimensional systems,” Int. J. Electron. 73, 1227–1232 (1992). [CrossRef]
  15. H. M. Ozaktas, “Toward an optimal foundation architecture for optoelectronic computing. Part I. Regularly interconnected device planes,” Appl. Opt. 36, 5682–5696 (1997). [CrossRef] [PubMed]
  16. H. M. Ozaktas, “Toward an optimal foundation architecture for optoelectronic computing, Part II. Physical construction and application platforms,” Appl. Opt. 36, 5697–5705 (1997). [CrossRef] [PubMed]
  17. H. B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI (Addison-Wesley, Reading, Mass., 1990).
  18. W. Nakayama, “On the accomodation of coolant flow paths in high density packaging,” IEEE Trans. Component Hybrids Manuf. Technol. 13, 1040–1049 (1990). [CrossRef]
  19. W. Nakayama, “Heat-transfer engineering in systems integration—outlook for closer coupling of thermal and electrical designs of computers,” IEEE Trans. Components Packag. Manuf. Technol. Part A 18, 818–826 (1995). [CrossRef]

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