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Applied Optics

Applied Optics


  • Vol. 40, Iss. 28 — Oct. 1, 2001
  • pp: 5052–5055

Precise and simple optical alignment method for double-sided lithography

Matthias Gruber, Detlev Hagedorn, and Werner Eckert  »View Author Affiliations

Applied Optics, Vol. 40, Issue 28, pp. 5052-5055 (2001)

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A method for aligning a photolithographic mask at the top of a transparent wafer that has a pattern on its bottom side is presented. The method is based on optical self-imaging of special alignment marks and provides submicrometer accuracy. The method is simple and robust and can conveniently be implemented on laboratory mask aligners for contact or proximity printing.

© 2001 Optical Society of America

OCIS Codes
(220.1140) Optical design and fabrication : Alignment
(220.3740) Optical design and fabrication : Lithography
(220.4000) Optical design and fabrication : Microstructure fabrication
(350.3950) Other areas of optics : Micro-optics

Original Manuscript: March 13, 2001
Revised Manuscript: May 31, 2001
Published: October 1, 2001

Matthias Gruber, Detlev Hagedorn, and Werner Eckert, "Precise and simple optical alignment method for double-sided lithography," Appl. Opt. 40, 5052-5055 (2001)

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  1. W. M. Moreau, Semiconductor Lithography, Principles, Practices, and Material (Plenum, New York, 1988).
  2. J. Jahns, A. Huang, “Planar integration of free-space optical components,” Appl. Opt. 28, 1602–1605 (1989). [CrossRef] [PubMed]
  3. D. Fey, W. Erhard, M. Gruber, J. Jahns, H. Bartelt, G. Grimm, L. Hoppe, S. Sinzinger, “Optical interconnects for neural and reconfigurable VLSI architectures,” Proc. IEEE 88, 838–848 (2000). [CrossRef]
  4. C. B. Kuznia, D. J. Albares, M. Wong, M. Pendleton, J. Green, J. Cable, R. Athale, R. E. Reedy, “Flip chip bonded optoelectronic devices on ultra-thin silicon-on-sapphire for parallel optical links,” in Optics in Computing 2001, 2001 OSA Technical Digest Series (Optical Society of America, Washington, D.C., 2001), pp. 134–136.
  5. J. Jahns, W. Däschner, “Precise alignment through thick wafers using an optical copying technique,” Opt. Lett. 17, 390–392 (1992). [CrossRef] [PubMed]
  6. G. C. Boisset, B. Robertson, W. Hsiao, M. Taghizadeh, J. Simmons, K. Song, M. Matin, D. Thompson, D. Plant, “On-die diffractive structures for packaging of microlens arrays with 2D optoelectronic device arrays,” IEEE Photon. Technol. Lett. 8, 918–920 (1996). [CrossRef]
  7. M. W. Farn, J. S. Kane, W. Delaney, “Dual-sided lithography: a method for evaluating alignment accuracy,” Appl. Opt. 31, 7295–7300 (1992). [CrossRef] [PubMed]
  8. J. Sasian, D. Baillie, “Simple technique for out-of-focus feature alignment,” Opt. Eng. 34, 564–566 (1995). [CrossRef]
  9. See the URL http://www.suss.com .
  10. M. Gruber, D. Hagedorn, W. Eckert, “Ausrichtung fotolithografischer Masken relativ zu Wafern,” German patent pending (15April2000).

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