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Applied Optics

Applied Optics


  • Vol. 41, Iss. 24 — Aug. 20, 2002
  • pp: 4996–5001

Surface displacement imaging by interferometry with a light emitting diode

Stefan Dilhaire, Stéphane Grauby, Sébastien Jorez, Luis David Patino Lopez, Jean-Michel Rampnoux, and Wilfrid Claeys  »View Author Affiliations

Applied Optics, Vol. 41, Issue 24, pp. 4996-5001 (2002)

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We present an imaging technique to measure static surface displacements of electronic components. A device is supplied by a transient current that creates a variation of temperature, thus a surface displacement. To measure the latter, a setup that is based on a Michelson interferometer is used. To avoid the phenomenon of speckle and the drawbacks inherent to it, we use a light emitting diode as the light source for the interferometer. The detector is a visible CCD camera that analyzes the optical signal containing the information of surface displacement of the device. Combining images, we extract the amplitude of the surface displacement. Out-of-plane surface-displacement images of a thermoelectric device are presented.

© 2002 Optical Society of America

OCIS Codes
(000.2190) General : Experimental physics
(110.6820) Imaging systems : Thermal imaging
(120.6810) Instrumentation, measurement, and metrology : Thermal effects
(260.3160) Physical optics : Interference

Original Manuscript: November 29, 2001
Revised Manuscript: February 27, 2002
Published: August 20, 2002

Stefan Dilhaire, Stéphane Grauby, Sébastien Jorez, Luis David Patino Lopez, Jean-Michel Rampnoux, and Wilfrid Claeys, "Surface displacement imaging by interferometry with a light emitting diode," Appl. Opt. 41, 4996-5001 (2002)

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  1. K. Nassim, L. Joannes, A. Cornet, S. Dilhaire, E. Schaub, W. Claeys, “Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI),” Microelectron. Reliab. 38, 1341–1345 (1998). [CrossRef]
  2. T. Pfeifer, H. Mischo, A. Ettemeyer, Z. Wang, R. A. Wegner, “Strain/stress measurements using electronic speckle pattern interferometry,” in Three-Dimensional Imaging, Optical Metrology, and Inspection IV, K. G. Harding, D. J. Svetkoff, K. Creath, J. S. Harris, eds., Proc. SPIE3520, 262–271 (1998). [CrossRef]
  3. S. Dilhaire, S. Jorez, A. Cornet, E. Schaub, W. Claeys, “Optical method for the measurement of the thermomechanical behaviour of electronic devices,” Microelectron. Reliab. 38, 981–985 (1999).
  4. S. Dilhaire, S. Grauby, S. Jorez, J.-M. Rampnoux, W. Claeys, “Modulated thermomechanical imaging using heterodyne ESPI,” Rev. Sci. Instrum., submitted for publication.
  5. J. W. Goodman, “An introduction to the principles and applications of holography,” Proceedings of the SPIE, 59, n°9, pp. 1292–1304 (1971).
  6. R. Jones, C. Wykes, Holographic and Speckle Pattern Interferometry (Cambridge U. Press, Cambridge, 1989).
  7. B. Sharp, “Electronic Speckle Pattern Interferometry (ESPI),” Opt. Lasers Eng. 11, 241–255 (1989). [CrossRef]
  8. P. Gleyzes, F. Guernet, A. C. Boccara, “Profilométrie picométrique. II. L’approche multi-détecteur et la détection synchrone multiplexée,” J. Opt. (Paris), 26, 251–265 (1995). [CrossRef]
  9. S. Lévèque, A. C. Boccara, M. Lebec, H. Saint-Jalmes, “Ultrasonic tagging of photons paths in scattering media: parallel speckle modulation processing,” Opt. Lett. 24, 181–183 (1999). [CrossRef]
  10. S. Grauby, B. C. Forget, S. Holé, D. Fournier, “High resolution photothermal imaging of high frequency phenomena using a visible CCD camera associated with a multichannel lock-in scheme,” Rev. Sci. Instrum. 70, 3603–3608 (1999). [CrossRef]
  11. A. Dubois, M. Lebec, A. C. Boccara, “Real-time reflectivity and topography imagery of depth-resolted microscopic surfaces,” Opt. Lett. 24, 309–311 (1999). [CrossRef]
  12. H. Glosch, M. Ashauer, U. Pfeiffer, W. Lang, “A thermoelectric converter for energy supply,” Sens. Actuators 74, 246–250 (1999). [CrossRef]
  13. D. D. L. Wijngaards, S. H. Kong, M. Bartek, R. F. Wolffenbuttel, “Design and fabrication of on-chip integrated polySiGe and polySi Peltier devices,” Sens. Actuators 85, 316–323 (2000). [CrossRef]

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