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Applied Optics

Applied Optics


  • Vol. 42, Iss. 33 — Nov. 20, 2003
  • pp: 6605–6612

Optical Nonreciprocal Devices with a Silicon Guiding Layer Fabricated by Wafer Bonding

Hideki Yokoi, Tetsuya Mizumoto, and Yuya Shoji  »View Author Affiliations

Applied Optics, Vol. 42, Issue 33, pp. 6605-6612 (2003)

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Optical nonreciprocal devices with a silicon guiding layer fabricated by wafer bonding are proposed. The optical nonreciprocal devices are composed of a magneto-optic waveguide with a magnetic garnet/Si/SiO<sub>2</sub> structure. Nonreciprocal characteristics are obtained by an evanescent field penetrating into the upper magnetic garnet cladding layer. Several kinds of the optical nonreciprocal device are investigated with the magneto-optic waveguide and designed at a wavelength of 1.55 μm. As a preliminary experiment, wafer bonding between Gd<sub>3</sub>Ga<sub>5</sub>O<sub>12</sub> and Si was studied. Wafer bonding was successfully achieved with heat treatment at 220 °C in H<sub>2</sub> ambient.

© 2003 Optical Society of America

OCIS Codes
(230.3120) Optical devices : Integrated optics devices
(230.3240) Optical devices : Isolators
(250.5300) Optoelectronics : Photonic integrated circuits

Hideki Yokoi, Tetsuya Mizumoto, and Yuya Shoji, "Optical Nonreciprocal Devices with a Silicon Guiding Layer Fabricated by Wafer Bonding," Appl. Opt. 42, 6605-6612 (2003)

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