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Applied Optics

Applied Optics

APPLICATIONS-CENTERED RESEARCH IN OPTICS

  • Vol. 43, Iss. 24 — Aug. 20, 2004
  • pp: 4652–4658

Three-Dimensional Deformation Measurement from the Combination of In-Plane and Out-Of-Plane Electronic Speckle Pattern Interferometers

Amalia Martínez, Juan A. Rayas, Ramón Rodríguez-Vera, and Héctor J. Puga  »View Author Affiliations


Applied Optics, Vol. 43, Issue 24, pp. 4652-4658 (2004)
http://dx.doi.org/10.1364/AO.43.004652


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Abstract

An optical setup that can be switched to produce in-plane and out-of-plane sensitivity interferometers was designed for three-dimensional deformation measuring by electronic speckle pattern interferometry. Divergent illumination is considered in the evaluation of sensitivity vectors to measure both in-plane and out-of-plane displacement components. The combination of these interferometers presents the advantage of greater sensitivity in directions u, v, and w than a typical interferometer with three illumination beams provides. The system and its basic operation are described, and results with an elastic target that is exposed to a mechanical load are reported.

© 2004 Optical Society of America

OCIS Codes
(120.3940) Instrumentation, measurement, and metrology : Metrology
(120.6160) Instrumentation, measurement, and metrology : Speckle interferometry
(150.3040) Machine vision : Industrial inspection
(200.4880) Optics in computing : Optomechanics

Citation
Amalia Martínez, Juan A. Rayas, Ramón Rodríguez-Vera, and Héctor J. Puga, "Three-Dimensional Deformation Measurement from the Combination of In-Plane and Out-Of-Plane Electronic Speckle Pattern Interferometers," Appl. Opt. 43, 4652-4658 (2004)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-43-24-4652


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References

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