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Applied Optics

Applied Optics


  • Vol. 44, Iss. 14 — May. 10, 2005
  • pp: 2768–2771

Far-field pattern simulation of flip-chip bonded power light-emitting diodes by a Monte Carlo photon-tracing method

Fei Hu, Ke-Yuan Qian, and Yi Luo  »View Author Affiliations

Applied Optics, Vol. 44, Issue 14, pp. 2768-2771 (2005)

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The far-field pattern of light-emitting diodes (LEDs) is an important issue in practical applications. We used a Monte Carlo photon-tracing method for the package design of flip-chip bonded power LEDs. As a first-order approximation, we propose using a plane light source model to calculate the far-field pattern of encapsulated LEDs. The far-field pattern is also studied by use of a more detailed model, which takes the structure of all epitaxial layers of a flip-chip bonded power LED into consideration. By comparing the simulation results with the experimental data, we have concluded that the plane light source model is much less time-consuming and offers fairly good precision for package design.

© 2005 Optical Society of America

OCIS Codes
(080.2720) Geometric optics : Mathematical methods (general)
(230.3670) Optical devices : Light-emitting diodes

Original Manuscript: July 29, 2004
Revised Manuscript: November 25, 2004
Manuscript Accepted: December 8, 2004
Published: May 10, 2005

Fei Hu, Ke-Yuan Qian, and Yi Luo, "Far-field pattern simulation of flip-chip bonded power light-emitting diodes by a Monte Carlo photon-tracing method," Appl. Opt. 44, 2768-2771 (2005)

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