The far-field pattern of light-emitting diodes (LEDs) is an important issue in practical applications. We used a Monte Carlo photon-tracing method for the package design of flip-chip bonded power LEDs. As a first-order approximation, we propose using a plane light source model to calculate the far-field pattern of encapsulated LEDs. The far-field pattern is also studied by use of a more detailed model, which takes the structure of all epitaxial layers of a flip-chip bonded power LED into consideration. By comparing the simulation results with the experimental data, we have concluded that the plane light source model is much less time-consuming and offers fairly good precision for package design.
© 2005 Optical Society of America
Original Manuscript: July 29, 2004
Revised Manuscript: November 25, 2004
Manuscript Accepted: December 8, 2004
Published: May 10, 2005
Fei Hu, Ke-Yuan Qian, and Yi Luo, "Far-field pattern simulation of flip-chip bonded power light-emitting diodes by a Monte Carlo photon-tracing method," Appl. Opt. 44, 2768-2771 (2005)