A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.
© 2005 Optical Society of America
(120.2130) Instrumentation, measurement, and metrology : Ellipsometry and polarimetry
(120.4290) Instrumentation, measurement, and metrology : Nondestructive testing
(120.5410) Instrumentation, measurement, and metrology : Polarimetry
Wen-Kai Kuo, Deng-Tzung Tang, Chien-Jang Wu, and Thomson Lai, "Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique," Appl. Opt. 44, 4205-4210 (2005)