Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique
Applied Optics, Vol. 44, Issue 20, pp. 4205-4210 (2005)
http://dx.doi.org/10.1364/AO.44.004205
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Abstract
A new technique for testing a ball grid array (BGA) package substrate that uses the electro-optic (EO) probing technique is investigated. This technique can detect open circuits in the BGA substrate with a high spatial resolution. An experimental setup that uses an EO probe tip made of LiNbO3 crystal is reported along with the measurement results from a real BGA substrate.
© 2005 Optical Society of America
OCIS Codes
(120.2130) Instrumentation, measurement, and metrology : Ellipsometry and polarimetry
(120.4290) Instrumentation, measurement, and metrology : Nondestructive testing
(120.5410) Instrumentation, measurement, and metrology : Polarimetry
Citation
Wen-Kai Kuo, Deng-Tzung Tang, Chien-Jang Wu, and Thomson Lai, "Noncontact electrical test of a ball grid array substrate that uses the electro-optic probing technique," Appl. Opt. 44, 4205-4210 (2005)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-44-20-4205
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