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Applied Optics

Applied Optics

APPLICATIONS-CENTERED RESEARCH IN OPTICS

  • Vol. 44, Iss. 21 — Jul. 20, 2005
  • pp: 4429–4434

Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology

Shunquan Wang, Changhe Zhou, Huayi Ru, and Yanyan Zhang  »View Author Affiliations


Applied Optics, Vol. 44, Issue 21, pp. 4429-4434 (2005)
http://dx.doi.org/10.1364/AO.44.004429


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Abstract

Polymer deposition is a serious problem associated with the etching of fused silica by use of inductively coupled plasma (ICP) technology, and it usually prevents further etching. We report an optimized etching condition under which no polymer deposition will occur for etching fused silica with ICP technology. Under the optimized etching condition, surfaces of the fabricated fused silica gratings are smooth and clean. Etch rate of fused silica is relatively high, and it demonstrates a linear relation between etched depth and working time. Results of the diffraction of gratings fabricated under the optimized etching condition match theoretical results well.

© 2005 Optical Society of America

OCIS Codes
(050.1380) Diffraction and gratings : Binary optics
(220.4000) Optical design and fabrication : Microstructure fabrication
(230.1950) Optical devices : Diffraction gratings

History
Original Manuscript: September 16, 2004
Revised Manuscript: February 27, 2005
Manuscript Accepted: March 7, 2005
Published: July 20, 2005

Citation
Shunquan Wang, Changhe Zhou, Huayi Ru, and Yanyan Zhang, "Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology," Appl. Opt. 44, 4429-4434 (2005)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-44-21-4429


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