Multiscale free-space optical interconnects for intrachip global communication: motivation, analysis, and experimental validation
Applied Optics, Vol. 45, Issue 25, pp. 6358-6366 (2006)
http://dx.doi.org/10.1364/AO.45.006358
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Abstract
The use of optical interconnects for communication between points on a microchip is motivated by system-level interconnect modeling showing the saturation of metal wire capacity at the global layer. Free-space optical solutions are analyzed for intrachip communication at the global layer. A multiscale solution comprising microlenses, etched compound slope microprisms, and a curved mirror is shown to outperform a single-scale alternative. Microprisms are designed and fabricated and inserted into an optical setup apparatus to experimentally validate the concept. The multiscale free-space system is shown to have the potential to provide the bandwidth density and configuration flexibility required for global communication in future generations of microchips.
© 2006 Optical Society of America
OCIS Codes
(200.4650) Optics in computing : Optical interconnects
(220.4000) Optical design and fabrication : Microstructure fabrication
(220.4830) Optical design and fabrication : Systems design
History
Original Manuscript: December 1, 2005
Revised Manuscript: May 1, 2006
Manuscript Accepted: May 21, 2006
Citation
Michael J. McFadden, Muzammil Iqbal, Thomas Dillon, Rohit Nair, Tian Gu, Dennis W. Prather, and Michael W. Haney, "Multiscale free-space optical interconnects for intrachip global communication: motivation, analysis, and experimental validation," Appl. Opt. 45, 6358-6366 (2006)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-45-25-6358
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