Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry
Applied Optics, Vol. 46, Issue 15, pp. 2863-2869 (2007)
http://dx.doi.org/10.1364/AO.46.002863
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Abstract
The resolution of an angle-scanning technique for measuring transparent optical wafers is analyzed, and it is shown both theoretically and experimentally that subnanometer resolution can be readily achieved. Data are acquired simultaneously over the whole area of the wafer, producing two-dimensional thickness variation maps in as little as 10 s.
Repeatabilities of
© 2007 Optical Society of America
OCIS Codes
(120.0120) Instrumentation, measurement, and metrology : Instrumentation, measurement, and metrology
(120.2230) Instrumentation, measurement, and metrology : Fabry-Perot
(160.3730) Materials : Lithium niobate
(220.4840) Optical design and fabrication : Testing
ToC Category:
Instrumentation, Measurement, and Metrology
History
Original Manuscript: November 9, 2006
Manuscript Accepted: January 8, 2007
Published: May 1, 2007
Citation
David I. Farrant, John W. Arkwright, Philip S. Fairman, and Roger P. Netterfield, "Measuring the thickness profiles of wafers to subnanometer resolution using Fabry-Perot interferometry," Appl. Opt. 46, 2863-2869 (2007)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-46-15-2863
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