Spectrally resolved white-light interferometry for 3D inspection of a thin-film layer structure
Applied Optics, Vol. 48, Issue 4, pp. 799-803 (2009)
http://dx.doi.org/10.1364/AO.48.000799
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Abstract
We describe an improved scheme of spectrally resolved white-light interferometry, which provides 3D visual inspection of a thin-film layer structure with nanometer level resolutions. Compared to the authors’ previous method [ Appl. Phys. Lett. 91, 091903 (2007)], 3D tomographic information of thin films can be obtained by decoupling the film thickness and top surface profile, which is embodied by inducing spectral carrier frequency to the reference arm and applying a low-pass filter to the interfero gram instead of two troublesome measurement steps of activating and deactivating a mechanical shutter. We test and verify our proposed method by measuring a patterned thin-film layer structure as well as standard specimens of thin films with various thicknesses.
© 2009 Optical Society of America
OCIS Codes
(070.4790) Fourier optics and signal processing : Spectrum analysis
(120.3180) Instrumentation, measurement, and metrology : Interferometry
(120.3940) Instrumentation, measurement, and metrology : Metrology
(120.4290) Instrumentation, measurement, and metrology : Nondestructive testing
(120.5050) Instrumentation, measurement, and metrology : Phase measurement
(310.6860) Thin films : Thin films, optical properties
ToC Category:
Thin Films
History
Original Manuscript: October 23, 2008
Revised Manuscript: December 11, 2008
Manuscript Accepted: December 17, 2008
Published: January 26, 2009
Citation
Young-Sik Ghim and Seung-Woo Kim, "Spectrally resolved white-light interferometry for 3D inspection of a thin-film layer structure," Appl. Opt. 48, 799-803 (2009)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-48-4-799
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